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Two Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We present results of modeling for the design of microgaps for the removal of high heat fluxes via a strategy of high mass flux, high quality, and twophase forced convection. Modeling includes (1) thermodynamic analysis ...
Three Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports on novel thermal testbeds with embedded micropinfin heat sinks that were designed and microfabricated in silicon. Two micropinfin arrays were presented, each with a nominal pin height of 200 خ¼m and ...
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two ...